Campus Units

Aerospace Engineering, Mechanical Engineering

Document Type

Conference Proceeding

Conference

Materials Processing and Design: Modeling, Simulation and Applications, NUMIFORM 2004

Publication Version

Published Version

Publication Date

6-2004

Journal or Book Title

AIP Conference Proceedings

Volume

712

First Page

123

Last Page

128

DOI

10.1063/1.1766511

Conference Title

8TH INTERNATIONAL CONFERENCE ON NUMERICAL METHODS IN INDUSTRIAL FORMING PROCESSES

Conference Date

June 13-17, 2004

City

Columbus, Ohio

Abstract

The material detachment mechanisms of ductile metal surfaces are studied experimentally during dry grinding operation in a simulated experiment with near single grit contact with the surface. The spectra of the cutting and thrust forces are recorded and analyzed. It is found that the thrust force changes its direction from a compressive to a tensile mode. The ratio between the thrust and cutting force is consistently found to be greater than 1. In the grinding process, the chip is found to be much shorter and thicker than those predicted by traditional continuum cutting theories. From the analysis of chip dimensions and cutting forces, we speculate that the cutting process during a grinding operation comprises of three phases as follows: (i) lifting up of the surface ahead of the abrasive particle, (ii) segmentation through shear instability, and finally (iii) chip tearing from the surface. Accordingly, the heating cycle is much longer with a lower mean temperature, compared to those of macro machining. In addition, the proposed deformation field leads to loss of constraints ahead of the cutting grits, and possibly reducing the thrust to cutting force ratio. This suggests that forming took place prior to material detachment in grinding.

Comments

The following article appeared in AIP Conference Proceedings 712 (2004): 123, and may be found at doi: 10.1063/1.1766511.

Rights

Copyright 2004 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.

Copyright Owner

American Institute of Physics

Language

en

File Format

application/pdf

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