Campus Units

Aerospace Engineering, Mechanical Engineering

Document Type

Article

Publication Version

Published Version

Publication Date

11-2003

Journal or Book Title

Journal of Manufacturing Science and Engineering

Volume

125

Issue

4

First Page

731

Last Page

735

DOI

10.1115/1.1619964

Abstract

A combined experimental and modeling approach has been devised to understand the material removal mechanism during abrasion of ductile copper discs. First, single grit scratch intersection experiments are conducted at the micro-scale (with 1-30 mm depth of cut). This is followed by FEM analysis. Then a simple analytical model is developed, and the model prediction is verified against experimental observations and results from numerical simulations. A characteristic material detachment length is correlated between experimental observations and model predictions. The insights gained from this exercise may be used to develop a mechanistic model of material removal in chemical mechanical polishing (CMP) of ductile materials.

Comments

This article is from Journal of Manufacturing Science and Engineering 125 (2003): 731, doi: 10.1115/1.1619964. Posted with permission.

Copyright Owner

ASME

Language

en

File Format

application/pdf

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