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Submissions from 2013

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In Situ Stress Measurement During Aluminum Anodizing Using Phase-Shifting Curvature Interferometry, Ömer Özgür Çapraz, Kurt R. Hebert, and Pranav Shrotriya

Submissions from 2012

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Oxide Growth Efficiencies and Self-Organization of TiO2 Nanotubes, Sergiu P. Albu, Nicola Taccardi, Indhu Paramasivam, Kurt R. Hebert, and Patrik Schmuki

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High-throughput synthesis of carbohydrates and functionalization of polyanhydride nanoparticles, Brenda Rocio Carrillo-Conde, Rajarshi Roychoudhury, Ana Vianey Chavez-santoscoy, Balaji Narasimhan, and Nicola L.B. Pohl

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Combinatorial Synthesis of and high-throughput protein release from polymer film and nanoparticle libraries, Latrisha K. Petersen, Ana Vianey Chavez-Santoscoy, and Balaji Narasimhan

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Atom Probe Tomography Characterization of Thin Copper Layers on Aluminum Deposited by Galvanic Displacement, Yi Zhang, Jiahe Ai, Andrew C. Hillier, and Kurt R. Hebert

Submissions from 2011

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Copper Layers Deposited on Aluminum by Galvanic Displacement, Jiahe Ai, S. P. Liu, Newira A. Widharta, Saikat Adhikari, James W. Anderegg, and Kurt R. Hebert

Submissions from 2010

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Statistical model of defects in Al-H system, Min Ji, Cai-Zhuang Wang, Kai-Ming Ho, Saikat Adhikari, and Kurt R. Hebert

Submissions from 2009

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A Model for Coupled Electrical Migration and Stress-Driven Transport in Anodic Oxide Films, Kurt R. Hebert and Jerrod E. Houser

Submissions from 2008

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Participation of Aluminum Hydride in the Anodic Dissolution of Aluminum in Alkaline Solutions, Saikat Adhikari and Kurt R. Hebert

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Formation of Aluminum Hydride during Alkaline Dissolution of Aluminum, Saikat Adhikari, Jinju Lee, and Kurt R. Hebert

Submissions from 2006

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Modeling the Potential Distribution in Porous Anodic Alumina Films during Steady-State Growth, Jerrod E. Houser and Kurt R. Hebert

Submissions from 2005

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Role of Chloride Ions in Suppression of Copper Electrodeposition by Polyethylene Glycol, Kurt R. Hebert

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Chemical Mechanism of Suppression of Copper Electrodeposition by Poly(ethylene glycol), Kurt R. Hebert, Saikat Adhikari, and Jerrod E. Houser

Submissions from 2004

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Positron Annihilation Spectroscopy Study of Interfacial Defects Formed by Anodic Oxidation of Aluminum, Kurt R. Hebert, Thomas Gessman, Kelvin Lynn, and P. Asoka-Kumar

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Effect of Impurities on Interfacial Void Formation in Aluminum, Renchun Huang, Kurt R. Hebert, Thomas Gessman, and Kelvin Lynn

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Microscopic Observations of Voids in Anodic Oxide Films on Aluminum, R. Huang, Kurt R. Hebert, and L. Scott Chumbley

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Kinetic Model for Aluminum Dissolution in Corrosion Pits, Kamal Muthukrishnan and Kurt R. Hebert

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Interfacial Void Model for Corrosion Pit Initiation on Aluminum, Kamal Muthukrishnan, Kurt R. Hebert, and Takeshi Makino

Submissions from 2002

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Corrosion-Related Interfacial Defects Formed by Dissolution of Aluminum in Aqueous Phosphoric Acid, Huiquan Wu, Kurt R. Hebert, Thomas Gessman, and Kelvin Lynn

Submissions from 2001

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A Mathematical Model for the Growth of Aluminum Etch Tunnels, Kurt R. Hebert

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Analysis of Current-Potential Hysteresis during Electrodeposition of Copper with Additives, Kurt R. Hebert

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Positron Annihilation Spectroscopy Study of Interfacial Defects Formed by Dissolution of Aluminum in Aqueous Sodium Hydroxide, Kurt R. Hebert, Huiquan Wu, Thomas Gessman, and Kelvin Lynn

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Atomic Force Microscopy Study of Anodic Etching of Aluminum: Etching Morphology Development and Caustic Pretreatment, Thierry Martin and Kurt R. Hebert

Submissions from 2000

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Kinetic Model for Oxide Film Passivation in Aluminum Etch Tunnels, Nishant Sinha and Kurt R. Hebert

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Metal Dissolution Kinetics in Aluminum Etch Tunnels, Yongsug Tak, Nishant Sinha, and Kurt R. Hebert

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Atomic Force Microscopy Study of the Initial Stages of Anodic Oxidation of Aluminum in Phosphoric Acid Solution, Huiquan Wu, Xiao Zhang, and Kurt R. Hebert

Submissions from 1999

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Electrochemical Current Noise on Aluminum Microelectrodes, Joseph W. Isaac and Kurt R. Hebert

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Metal and Oxygen Ion Transport during Ionic Conduction in Amorphous Anodic Oxide Films, Mei-Hui Wang and Kurt R. Hebert

Submissions from 1998

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A Mathematical Model for the Initiation of Aluminum Etch Tunnels, Ying Zhou and Kurt R. Hebert

Submissions from 1996

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An Electrical Model for the Cathodically Charged Aluminum Electrode, Mei-Hui Wang and Kurt R. Hebert

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Development of Surface Impurity Segregation during Dissolution of Aluminum, Xiaolin Wu and Kurt R. Hebert

Submissions from 1994

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Changes Produced by Cathodic Polarization in the Electrical Conduction Behavior of Surface Films on Aluminum, Ching-Feng Lin and Kurt R. Hebert

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Surface Films Produced by Cathodic Polarization of Aluminum, Ching-Feng Lin, Marc D. Porter, and Kurt R. Hebert

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Initial Events during the Passivation of Rapidly Dissolving Aluminum Surfaces, Yongsug Tak and Kurt R. Hebert

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Evolution of Microscopic Surface Topography during Passivation of Aluminum, Yongsug Tak, Eric R. Henderson, and Kurt R. Hebert

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Detection of Corrosion‐Related Defects in Aluminum Using Positron Annihilation Spectroscopy, X. Wu, P. Asoka-Kumar, Kelvin Lynn, and Kurt R. Hebert

Submissions from 1991

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Passivation of Surfaces within Aluminum Etch Tunnels, Bruce J. Wiersma, Yongsug Tak, and Kurt R. Hebert