Angle Beam Ultrasonic Spectroscopy System for Quantitative Inspection of Adhesive Bonds
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Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.
This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.
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Abstract
Adhesive joining of materials has found widespread use in industry because of the simplicity and versatility of the process. However, adhesive applications in critical structural joints are still limited by the absence of reliable, rapid industrial NDE methods. Weak bonds remain hidden from conventional inspection methods capable of detecting only gross defects such as voids and open delamination. Weak bonds can exhibit substantially reduced strength without apparent defects.