Application of Inelastic Electron Tunneling to the Study of Adhesion
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Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.
This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.
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Abstract
The problem of devising meaningful and reliable methods for nondestructive evaluation of adhesively bonded joints has been the subject of considerable effort for many years. It remains an important and unsolved problem. The use of conventional NOT methods involving ultrasonics is not entirely satisfactory because the thickness of a bond line is small compared with typical acoustic wavelengths and, perhaps more importantly, because the strength and service life of an adhesive bond is dependent on its chemical as well as mechanical properties. That is, an adhesive bond that is mechanically perfect may fail because of chemical degradation initiated at the adhesive/adhered interface.