In this paper, the results of imaging experiments with the interfacial region~ of representative solid material joints, using a transmission-type scanning acoustic microscope operating at 150 MHz, are reported. Voids and flaws in specially made joints as well as production-line silicon solder bonds (die bonded headers) have been detected using the transmission-mode of operation of the microscope. Acoustic velocity of epoxy in an organic adhesive bond has also been measured using a combination of transmission and interference-mode of operation.