Document Type

Article

Publication Date

2006

Journal or Book Title

Applied Physics Letters

Volume

88

Issue

14

First Page

141903

DOI

10.1063/1.2191882

Abstract

A versatile surface processing method based on electrostatic deposition of particles and subsequent dry etching is shown to be able to tailor the autocorrelation length of a random surface by varying particle size and coverage. An explicit relation between final autocorrelation length, surface coverage of the particles, particle size, and etch depth is built. The autocorrelation length of the final surface closely follows a power law decay with particle coverage, the most significant processing parameter. Experimental results on silicon substrates agree reasonably well with model predictions.

Comments

The following article appeared in Applied Physics Letters 88 (2006): 141903, doi:10.1063/1.2191882.

Rights

Copyright 2006 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.

Copyright Owner

American Institute of Physics

Language

en

File Format

application/pdf

Share

COinS