Document Type

Article

Publication Date

7-31-2007

Journal or Book Title

Langmuir

Volume

23

Issue

16

First Page

8347

Last Page

8351

DOI

10.1021/la063346h

Abstract

A surface engineering method based on the electrostatic deposition of microparticles and dry etching is described and shown to be able to independently tune both amplitude and spatial roughness parameters of the final surface. Statistical models were developed to connect process variables to the amplitude parameters (center line average and root-mean-square) and a spatial parameter (autocorrelation length) of the final surfaces. Process variables include particle coverage, which affects both amplitude and spatial roughness parameters, particle size, which affects only spatial parameters, and etch depth, which affects only amplitude parameters. Correlations between experimental data and model predictions are discussed.

Comments

Reprinted with permission from Langmuir 23 (2007): 8347–831, doi:10.1021/la063346h. Copyright 2007 American Chemical Society.

Copyright Owner

American Chemical Society

Language

en

File Format

application/pdf

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