Document Type

Patent

Publication Date

9-20-1994

Abstract

A process for selectively etching silicon comprises preparing a solution of etchant which is a non-selective etch for at least silicon and aluminum. The prepared solution is preconditioned by adding atomic silicon to the solution and aging the solution after the addition of silicon for at least 30 minutes. Then, silicon substrates carrying aluminum are immersed in the preconditioned solution to etch the silicon while leaving the aluminum substantially unaffected.

Patent Number

US 5,348,617

Assignee

Iowa State University Research Foundation, Inc.

Application Number

07/813,152

Date Filed

12-23-1991

Language

en

File Format

application/pdf

Included in

Chemistry Commons

Share

COinS