NDE Characterization of Metallic Interfaces
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Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.
This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.
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Abstract
In recent years, the process of diffusion bonding has found considerable usage in the aerospace and nuclear power industries [1]. This process entails two surfaces being pressed together at elevated temperatures and high pressures. If ideal conditions are achieved, the bonded interface will have properties identical to those of the matrix metal and the microstructure will be continuous across the interface. There is a fine margin for error in attaining ideal conditions and the ability to characterize the bond nondestructively is highly desirable. The present project is aimed at the development of ultrasonic techniques for the characterization of interfaces between two joined parts. The techniques that are being used have applicability to components joined by diffusion bonding, pinch welding, and friction bonding, and may also be useful in nondestructive measurements of rubbing friction and for bond strength.