One of the most elusive yet critical problem in adhesive joints characterization is that of ‘kissing bond’ wherein good contact exists among the adherend and the adhesive, however with no acceptable levels of adhesion. To date, the kissing bond is difficult to be detected reliably by any of the methods including conventional ultrasound and thermal waves. Kissing bond which is a manufacturing defect/anomaly will substantially compromise the load bearing capability of the adhesive joint by initiating adhesive failure (in contrast to cohesive failure wherein the failure occurs within the thickness of the adhesive layer instead of a failure at the interface). Attempts to develop methods of detection of kissing bonds have been unsuccessful to date.