Campus Units

Chemical and Biological Engineering, Materials Science and Engineering, Mechanical Engineering, Neuroscience, Ames Laboratory, Office of the Vice President for Research

Document Type

Article

Research Focus Area

Advanced and Nanostructured Materials

Publication Version

Published Version

Publication Date

7-22-2019

Journal or Book Title

Scientific Reports

Volume

9

First Page

10595

DOI

10.1038/s41598-019-46978-z

Abstract

In this study, a novel method based on the transfer of graphene patterns from a rigid or flexible substrate onto a polymeric film surface via solvent casting was developed. The method involves the creation of predetermined graphene patterns on the substrate, casting a polymer solution, and directly transferring the graphene patterns from the substrate to the surface of the target polymer film via a peeling-off method. The feature sizes of the graphene patterns on the final film can vary from a few micrometers (as low as 5 µm) to few millimeters range. This process, applied at room temperature, eliminates the need for harsh post-processing techniques and enables creation of conductive graphene circuits (sheet resistance: ~0.2 kΩ/sq) with high stability (stable after 100 bending and 24 h washing cycles) on various polymeric flexible substrates. Moreover, this approach allows precise control of the substrate properties such as composition, biodegradability, 3D microstructure, pore size, porosity and mechanical properties using different film formation techniques. This approach can also be used to fabricate flexible biointerfaces to control stem cell behavior, such as differentiation and alignment. Overall, this promising approach provides a facile and low-cost method for the fabrication of flexible and stretchable electronic circuits.

Comments

This article is published as Uz, Metin, Kyle Jackson, Maxsam S. Donta, Juhyung Jung, Matthew T. Lentner, John A. Hondred, Jonathan C. Claussen, and Surya K. Mallapragada. "Fabrication of High-resolution Graphene-based Flexible Electronics via Polymer Casting." Scientific Reports 9, no. 1 (2019): 10595. DOI: 10.1038/s41598-019-46978-z. Posted with permission.

Creative Commons License

Creative Commons Attribution 4.0 License
This work is licensed under a Creative Commons Attribution 4.0 License.

Copyright Owner

The Author(s)

Language

en

File Format

application/pdf

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