Chemical and Biological Engineering, Materials Science and Engineering, Mechanical Engineering, Neuroscience, Ames Laboratory
Research Focus Area
Advanced and Nanostructured Materials
Journal or Book Title
ACS Applied Materials and Interfaces
In this study, a simple microfluidic method, which can be universally applied to different rigid or flexible substrates, was developed to fabricate high-resolution, conductive, 2D and 3D microstructured graphene-based electronic circuits. The method involves controlled and selective filling of microchannels on substrate surfaces with a conductive binder-free graphene nanoplatelets (GNP) solution. The ethanol-thermal reaction of GNP solution at low temperatures (~75 °C) prior to microchannel filling (pre-heating) further reduces GNP, enhances conductivity, reduces sheet resistance (~0.05 kΩ sq-1), enables room temperature fabrication and eliminates harsh post-processing, which makes this fabrication technique compatible with degradable substrates. This method can also be used in combination with 3D printing to fabricate 3D circuits. The feature sizes of the graphene patterns can range from a few micrometers (down to ~15 µm in width and ~5 µm in depth) to a few millimeters and use very small amounts of GNP solution (~2.5 mg of graphene to obtain ~0.1 kΩ sq-1 of sheet resistance for 1 cm2). This microfluidic approach can also be implemented using other conductive liquids, such as conductive graphene-silver solutions. This technology has the potential to pave the way for low-cost, disposable and biodegradable circuits for a range of electronic applications including near field communication antennas, pressure or strain sensors.
American Chemical Society
Uz, Metin; Lentner, Matthew T.; Jackson, Kyle; Donta, Maxsam S.; Jung, Juhyung; Hondred, John; Mach, Eric; Claussen, Jonathan C.; and Mallapragada, Surya K., "Fabrication of Two-Dimensional and Three-Dimensional High-Resolution Binder-Free Graphene Circuits Using a Microfluidic Approach for Sensor Applications" (2020). Chemical and Biological Engineering Publications. 415.