Civil, Construction and Environmental Engineering, Electrical and Computer Engineering, Center for Nondestructive Evaluation (CNDE)
SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring
Journal or Book Title
Proceedings of SPIE
Research Focus Area
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems
March 8-12, 2015
San Diego, CA
The authors have developed a capacitive-based thin film sensor for monitoring strain on mesosurfaces. Arranged in a network configuration, the sensing system is analogous to a biological skin, where local strain can be monitored over a global area. The measurement principle is based on a measurable change in capacitance provoked by strain. In the case of bi-directional in-plane strain, the sensor output contains the additive measurement of both principal strain components. In this paper, we present an algorithm for retrieving the directional strain from measurements. The algorithm leverages the dense network application of the thin film sensor to reconstruct the surface strain map. A bi-directional shape function is assumed, and it is differentiated to obtain expressions for planar strain. A least square estimator (LSE) is used to reconstruct the planar strain map from the sensors measurement’s, after the system’s boundary conditions have been enforced in the model. The coefficients obtained by the LSE can be used to reconstruct the estimated strain map or the deflection shape directly. Results from numerical simulations and experimental investigations show good performance of the algorithm, in particular for monitoring surface strain on cantilever plates.
Society of Photo-Optical Instrumentation Engineers (SPIE)
Saleem, Hussam; Downey, Austin; and Laflamme, Simon, "Algorithm for decomposition of additive strain from dense network of thin film sensors" (2015). Civil, Construction and Environmental Engineering Conference Presentations and Proceedings. 76.