Campus Units
Civil, Construction and Environmental Engineering, Electrical and Computer Engineering, Materials Science and Engineering, Center for Nondestructive Evaluation (CNDE)
Document Type
Article
Publication Version
Submitted Manuscript
Publication Date
4-2015
Journal or Book Title
International Journal of Adhesion and Adhesives
Volume
58
First Page
28
Last Page
33
DOI
10.1016/j.ijadhadh.2015.01.001
Abstract
The peel resistance of four adhesives (“J-B Weld” by J-B Weld (adhesive A), 3 M Scotch-Weld DP 125 Gy (adhesive B), Loctite PL Premium (3x) Construction Adhesive (adhesive C), and Henkel Hysol EA9394 (adhesive D)) is investigated for their bonding performance of a styrene‐ethylene/butylene‐styrene– carbon black (SEBS–CB) composite membrane used in structural health monitoring (SHM) applications. Tests are performed on membrane samples bonded on four common structural materials, namely aluminium, steel, concrete, and fiberglass, to obtain the peel resistance of adhesives. Results show that adhesive B has the highest strength for aluminium, steel, and fiberglass substrates, and that adhesive C has the highest strength for the concrete substrate. The performance is also evaluated versus adhesive cost, a critical variable in SHM applications. Here, adhesive C performed best for all substrates. Lastly, membrane residuals resulting from the peel tests are compared. Tests show that Adhesive B resulted in the highest residual percentage for aluminium, while adhesive C performed better for all other substrates. However, membrane residuals for adhesive C do not show a positive correlation with the peel resistance.
Research Focus Area
Structural Engineering
Copyright Owner
Elsevier Ltd.
Copyright Date
2015
Language
en
File Format
application/pdf
Recommended Citation
Zeng, Wei; Sun, Weixing; Bowler, Nicola; and Laflamme, Simon, "Peel resistance of adhesive joints with elastomer–carbon black composite as surface sensing membranes" (2015). Civil, Construction and Environmental Engineering Publications. 82.
https://lib.dr.iastate.edu/ccee_pubs/82
Included in
Civil Engineering Commons, Structural Materials Commons, VLSI and Circuits, Embedded and Hardware Systems Commons
Comments
NOTICE: this is the author's version of a work that was accepted for publication in International Journal of Adhesion and Adhesives. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in the document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in International Journal of Adhesion and Adhesives; 58 (April 2015);28-33. Doi: 10.1016/j.ijadhadh.2015.01.001.