Imaging and Characterization of Thick Production-Line Microelectronic Components using Transmission Acoustic Microscopy
Date
1979
Authors
Tsai, Chen
Wang, Jung
Lee, Chin
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Abstract
The interfacial regions of four types of production-line microelectronic components (die-bonded transistor headers, high power silicon transistors, chip-resistors, and multilayer chip-capacitors) have been examined using a transmission scanning acoustic microscope operating at 150 MHz and a combination of modes. Flaws, voids, and defects in these components have been detected. Some characterization of these defects has also been obtained.
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Mon Jan 01 00:00:00 UTC 1979