Pb-Free Sn-Ag-Cu-Mn Solder
Date
2010-08-12
Authors
Anderson, Iver
Harringa, Joel
Walleser, Jason
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Iowa State University Research Foundation, Inc.
The Iowa State University Research Foundation (ISURF) seeks to protect the intellectual property (including new discoveries, technologies, or creative works) of the university's students & faculty which is continuously created through research and other undertakings. It seeks to manage, protect, and own all intellectual property on behalf of the university. The Iowa State University Research Foundation was created in 1938.
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Abstract
A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees C. A solder joint and solder process embody the solder alloy as well as solder balls and solder paste made therefrom to provide a solidified joint that includes three different intermetallic phases and a Sn metal phase. An exemplary Sn—Ag—Cu—Mn alloy consists essentially of about 3 to about 4 weight % Ag, about 0.80 to about 1.0 weight % Cu, and about 0.05 to about 0.15 weight % Mn, and balance consisting essentially of Sn.