Characterization of Film Adhesion by Acoustic Microscopy
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Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.
This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.
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Abstract
Accurate and reliable information on adhesive bond strength between dissimilar solids is an important factor in joint technology. In spite of considerable efforts to obtain a quantitative measure of film adhesion, this parameter remains elusive, particularly so in cases where non-destructive means of determination are desirable if not mandatory.