Detection of Composite Delaminations and Broken Solder Joints by a Full-Field Laser Doppler Technique
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Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.
This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.
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Abstract
A method for full-field non-contact vibration measurement based on the Michelson Interferometer has been developed and applied to a wide range of components and structures. Unlike other optical techniques such as holography, the vibration imager does not require a specialized laboratory and stable environment, works over a much wider dynamic range,and the vibration time history is available for a more detailed analysis of the structures response. Use of this technique to detect delaminations in graphite/epoxy specimens is explored in this paper. The data was compared with X-ray and ultrasonic methods. The integrity of solder joints in electronic circuit boards has also been studied by this method at the University of Wisconsin, Madison and is also presented in this paper.