IC Chip Package Inspection with an Amplitude and Phase Scanning Acoustic Microscope
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Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.
This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.
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Abstract
This paper will review and compare the principles of operation of the scanning acoustic microscope and the focused C-scan imaging System. We will show that with phase measurement ability, both instruments are capable of inspecting electronic packages for disbonds, cracks, and other defects given. We will also show that the resolution and defect detection sensitivity of both instruments is limited by the attenuation of the sound wave in the package.