Adhesive/Adherend Interlayer Property Measurement by Acoustic Microscopy
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Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.
This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.
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Abstract
Adhesive bonding of aluminum holds some possible advantages over the traditional methods of construction in the aerospace industry. However, there is uncertainty about the mechanism of adhesive bonding and the changes occurring during environmental attack which reduce the bond strength. An improved understanding will aid in the development of better techniques for non-destructive testing (NDT) of joints by determining what properties should be measured and will lead to the development of better adhesive systems.