With the increasing use of adhesives in the automotive, aerospace, and manufacturing industries, there is a growing interest in developing nondestructive methods for locating defects in adhesive bonds. While conventional techniques which utilize ultrasonic waves and Lamb waves are likely candidates for obtaining high resolution images of defects, these methods may not be practical for assembly line applications where the time required to scan the bonds and the access to the bonds are often limited. The objective of this work is to develop an approach for detecting defects in bonds that requires only a limited number of measurements of the reverberant acoustic wavefield (i.e., waves that are multiply scattered off the boundaries of the structure) made over a band of frequencies.