Aerospace Engineering, Center for Nondestructive Evaluation (CNDE)
SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring
Journal or Book Title
Proceedings of SPIE
Health Monitoring of Structural and Biological Systems
March 25-29, 2017
Electromechanical impedance (EMI) is an important technique for bond-line integrity monitoring of adhesively bonded joints in automotive and aerospace structures. In the current work, numerical analysis of temperature sensitivity of the EMI technique is performed. The objective is to detect stiffness reduction of the adhesive in the presence of temperature and external mechanical load. Increase in the operating temperature can degrade the bonded piezoelectric material causing misinterpretation of the EMI data. EMI Signal features are numerically investigated to decouple the effect of load and temperature on the piezoelectric material in the mechanically loaded bonded joint. The computational results indicate higher dependence of EM resonance spectrum towards piezoelectric material matrix as compared to the tensile load applied on the bonded sample as the stiffness of adhesive is numerically varied.
Society of Photo-Optical Instrumentation Engineers (SPIE)
Bilgunde, Prathamesh N. and Bond, Leonard J., "Temperature dependence of electromechanical impedance based bond-line integrity monitoring" (2017). Center for Nondestructive Evaluation Conference Papers, Posters and Presentations. 115.