Campus Units

Aerospace Engineering, Center for Nondestructive Evaluation (CNDE)

Document Type

Conference Proceeding

Conference

SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring

Publication Version

Published Version

Publication Date

4-5-2017

Journal or Book Title

Proceedings of SPIE

Volume

10170

Issue

101702Y

First Page

101702Y-1

Last Page

101702Y-11

DOI

10.1117/12.2260365

Conference Title

Health Monitoring of Structural and Biological Systems

Conference Date

March 25-29, 2017

City

Portland, OR

Abstract

Electromechanical impedance (EMI) is an important technique for bond-line integrity monitoring of adhesively bonded joints in automotive and aerospace structures. In the current work, numerical analysis of temperature sensitivity of the EMI technique is performed. The objective is to detect stiffness reduction of the adhesive in the presence of temperature and external mechanical load. Increase in the operating temperature can degrade the bonded piezoelectric material causing misinterpretation of the EMI data. EMI Signal features are numerically investigated to decouple the effect of load and temperature on the piezoelectric material in the mechanically loaded bonded joint. The computational results indicate higher dependence of EM resonance spectrum towards piezoelectric material matrix as compared to the tensile load applied on the bonded sample as the stiffness of adhesive is numerically varied.

Comments

This proceeding is published as Prathamesh Bilgunde, Leonard J. Bond, "Temperature dependence of electromechanical impedance based bond-line integrity monitoring," Proc. SPIE 10170, Health Monitoring of Structural and Biological Systems 2017, 101702Y (5 April 2017). doi: 10.1117/12.2260365. Posted with permission.

Copyright Owner

Society of Photo-Optical Instrumentation Engineers (SPIE)

Language

en

File Format

application/pdf

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Article Location

 
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