Degree Type

Creative Component

Semester of Graduation

Spring 2018


Electrical and Computer Engineering

First Major Professor

Dr Vikram Dalal

Second Major Professor

Dr Long Que


Master of Science (MS)


Electrical Engineering


Memory is used to store the data. Semiconductor memory can be used as our computer’s cache memory, in our mobile applications, in memory cards of our cameras. To meet the growing needs for memory, variety of different memories are used like DRAM, SRAM, etc. With the rapid growth in the requirement of memories new memory technologies are being developed and considerable amount of research is invested in these new memory technologies. One of a very new memory technology is 3DXP Memory. 3DXP is a type of Non-Volatile memory which has very high density and high speed as compared to any other Non-Volatile memory. It can be used in various applications like Genomics, sensing. In this report, I would like to introduce 3DXP Memory development and my work as a 3DXP Yield Enhancement Electrical Failure Analysis Engineer. In my creative component I was required to read and understand the literature about how different memories work. I was also assigned to do an internship on 3DXP Memory at Micron Technology Inc from March 12,2018 through August 3,2018. During my master’s degree I took some courses like Semiconductor Physics, Microelectronics Fabrication Techniques, Digital VLSI and Statistics which helped me to learn and apply the knowledge to solve problems at industrial level.

Copyright Owner

Nishtha Bhatnagar

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Engineering Commons