Title
Pulsed laser ablation and micromachining of 4H and 6H SiC wafers for high-temperature MEMS sensors
Degree Type
Thesis
Date of Award
2008
Degree Name
Master of Science
Department
Mechanical Engineering
First Advisor
Palaniappa A. Molian
Abstract
This thesis provides a scientific investigation of the ablation behavior of single crystal 4H-SiC and 6H-SiC to improve the manufacturability and high-temperature performance of SiC based MEMS pressure sensors using laser applications. The ablation characteristics of both the polytypes were studied using pulsed lasers and micromachining results were presented. The study shows the possibility of these devices capable of operating in harsh environments.
DOI
https://doi.org/10.31274/etd-180810-2407
Copyright Owner
Saurabh Gupta
Copyright Date
2008
Language
en
Date Available
2012-04-30
File Format
application/pdf
File Size
112 pages
Recommended Citation
Gupta, Saurabh, "Pulsed laser ablation and micromachining of 4H and 6H SiC wafers for high-temperature MEMS sensors" (2008). Graduate Theses and Dissertations. 10866.
https://lib.dr.iastate.edu/etd/10866
