Design and Manufacturing of a Flat-Plate Heat Pipe with Biphilic Surfaces
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The Department of Electrical and Computer Engineering (ECpE) contains two focuses. The focus on Electrical Engineering teaches students in the fields of control systems, electromagnetics and non-destructive evaluation, microelectronics, electric power & energy systems, and the like. The Computer Engineering focus teaches in the fields of software systems, embedded systems, networking, information security, computer architecture, etc.
History
The Department of Electrical Engineering was formed in 1909 from the division of the Department of Physics and Electrical Engineering. In 1985 its name changed to Department of Electrical Engineering and Computer Engineering. In 1995 it became the Department of Electrical and Computer Engineering.
Dates of Existence
1909-present
Historical Names
- Department of Electrical Engineering (1909-1985)
- Department of Electrical Engineering and Computer Engineering (1985-1995)
Related Units
- College of Engineering (parent college)
- Department of Physics and Electrical Engineering (predecessor)
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The Honors project is potentially the most valuable component of an Honors education. Typically Honors students choose to do their projects in their area of study, but some will pick a topic of interest unrelated to their major.
The Honors Program requires that the project be presented at a poster presentation event. Poster presentations are held each semester. Most students present during their senior year, but may do so earlier if their honors project has been completed.
This site presents project descriptions and selected posters for Honors projects completed since the Fall 2015 semester.
Department
Abstract
The objective of this project is to design and manufacture a flat-plate heat pipe capable of showing the fluid flow, the temperature distribution throughout the device, and determining the rate of heat transfer inside the system. The application of surfaces with modified wettability in phase change heat-transfer devices, such as a heat pipe, improve their heat transfer capabilities by facilitating the boiling and condensation of a working fluid [1]. These surfaces of modified wettability grant the surface biphilic properties. The heat pipe is designed to have a replaceable surface of modified wettability. The heat pipe will contain a glass viewing panel on the top to observe the fluid flow inside the system, while a viewing panel will be on the bottom to allow for qualitative observation off the heat flow with an infrared camera. The heat transfer capabilities will be quantified with thermocouples measuring the change in temperature of the cooling chamber fluid. The heat pipe is expected to improve the hea...