Micromagnetic modeling of the effects of stress on magnetic properties

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2001-06-01
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Zhu, B.
Lo, Chester
Lee, S. J.
Jiles, David
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Jiles, David
Distinguished Professor Emeritus
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Materials Science and Engineering
Materials engineers create new materials and improve existing materials. Everything is limited by the materials that are used to produce it. Materials engineers understand the relationship between the properties of a material and its internal structure — from the macro level down to the atomic level. The better the materials, the better the end result — it’s as simple as that.
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Abstract

A micromagnetic model has been developed for investigating the effect of stress on the magnetic properties of thin films. This effect has been implemented by including the magnetoelastic energy term into the Landau–Lifshitz–Gilbert equation. Magnetization curves of a nickelfilm were calculated under both tensile and compressive stresses of various magnitudes applied along the field direction. The modeling results show that coercivity increased with increasing compressive stress while remanence decreased with increasing tensile stress. The results are in agreement with the experimental data in the literature and can be interpreted in terms of the effects of the applied stress on the irreversible rotation of magnetic moments during magnetization reversal under an applied field.

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The following article appeared in Journal of Applied Physics 89 (2001): 7009 and may be found at http://dx.doi.org/10.1063/1.1363604.

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Mon Jan 01 00:00:00 UTC 2001
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