Title
In Situ Transmission Electron Microscopy Study of Conductive Filament Formation in Copper Oxides
Campus Units
Materials Science and Engineering
Document Type
Article
Publication Version
Accepted Manuscript
Publication Date
9-2020
Journal or Book Title
IEEE Transactions on Device and Materials Reliability
Volume
20
Issue
3
First Page
609
Last Page
612
DOI
10.1109/TDMR.2020.3015398
Abstract
The structural and electrical property changes of two types of copper oxides (CuO and Cu 2 O) under voltage bias are studied with in situ transmission electron microscopy (TEM). The phases of different materials are confirmed with electron diffraction. In both types of oxides, dynamic conductive path formation and dissolution are observed. The decrease in resistance of CuO film is found to be accompanied with the formation of Cu 4 O 3 phase where the electric field strength is highest. We also find that the decrease in resistivity of Cu 2 O film is more extensive and occurs in an area depending on the level of current compliance. The physical mechanisms responsible for the observations and their implications for the formation of conducting regions in copper oxide-based memristors are discussed.
Rights
© 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Copyright Owner
IEEE
Copyright Date
2020
Language
en
File Format
application/pdf
Recommended Citation
Tian, Xinchun; Yazdanparast, Sanaz; Brennecka, Geoff; and Tan, Xiaoli, "In Situ Transmission Electron Microscopy Study of Conductive Filament Formation in Copper Oxides" (2020). Materials Science and Engineering Publications. 381.
https://lib.dr.iastate.edu/mse_pubs/381
Comments
This is a manuscript of an article published as Tian, Xinchun, Sanaz Yazdanparast, Geoff Brennecka, and Xiaoli Tan. "In situ Transmission Electron Microscopy Study of Conductive Filament Formation in Copper Oxides." IEEE Transactions on Device and Materials Reliability 20, no. 3 (2020): 609-612. DOI: 10.1109/TDMR.2020.3015398. Posted with permission.