Campus Units

Electrical and Computer Engineering, Materials Science and Engineering, Microelectronics Research Center (MRC)

Document Type

Article

Publication Version

Accepted Manuscript

Publication Date

2-2-2021

Journal or Book Title

Angewandte Chemie International Edition

DOI

10.1002/anie.202013489

Abstract

Cool frustration: Engineering composition across a thin surface oxide layer of a metal particle, and stabilizing it with appropriate ligands, leads to a sharp surface stress that frustrates solidification. Chemical potential gradients from compositional variation and ligand inductive effects all contribute to stabilization of a metastable state. An undercooled liquid metal particle is formed, highlighting a new paradigm in engineering energy landscape of a material using thin surface layer, as described by Martin Thuo et al. in their Research Article (DOI: 10.1002/anie.202013489).

Comments

This is the peer-reviewed version of the following article: Angewandte Chemie International Edition, which has been published in final form at DOI: 10.1002/anie.202013489. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving. Posted with permission.

Copyright Owner

Wiley‐VCH GmbH

Language

en

File Format

application/pdf

Available for download on Wednesday, February 02, 2022

Published Version

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