Campus Units
Electrical and Computer Engineering, Materials Science and Engineering, Microelectronics Research Center (MRC)
Document Type
Article
Publication Version
Accepted Manuscript
Publication Date
2-2-2021
Journal or Book Title
Angewandte Chemie International Edition
DOI
10.1002/anie.202013489
Abstract
Cool frustration: Engineering composition across a thin surface oxide layer of a metal particle, and stabilizing it with appropriate ligands, leads to a sharp surface stress that frustrates solidification. Chemical potential gradients from compositional variation and ligand inductive effects all contribute to stabilization of a metastable state. An undercooled liquid metal particle is formed, highlighting a new paradigm in engineering energy landscape of a material using thin surface layer, as described by Martin Thuo et al. in their Research Article (DOI: 10.1002/anie.202013489).
Copyright Owner
Wiley‐VCH GmbH
Copyright Date
2021
Language
en
File Format
application/pdf
Recommended Citation
Martin, Andrew; Chang, Boyce; Pauls, Alana M.; Du, Chuanshen; and Thuo, Martin M., "Stabilization of Undercooled Metals via Passivating Oxide Layers" (2021). Materials Science and Engineering Publications. 399.
https://lib.dr.iastate.edu/mse_pubs/399
Comments
This is the peer-reviewed version of the following article: Angewandte Chemie International Edition, which has been published in final form at DOI: 10.1002/anie.202013489. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving. Posted with permission.