Methods Development for Non-Destructive Measurement of Bond Strength in Adhesively Bonded Structures

Thumbnail Image
Date
1975
Authors
Seydel, James
Major Professor
Advisor
Committee Member
Journal Title
Journal ISSN
Volume Title
Publisher
Authors
Research Projects
Organizational Units
Journal Issue
Is Version Of
Versions
Series
Series
Review of Progress in Quantitative Nondestructive Evaluation
Center for Nondestructive Evaluation

Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.

This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.

Department
Abstract

While reasonably satisfactory methods exist for nondestructively determining t he presence or absence of an adhesive bond, no method exists for nondestructively determining the strength of what appears to be a good bond. Bonds that do not attain their full strength can be caused by a thin layer of contaminant , improper surface roughness, and a variety of other surface phenomena that are difficult to detect by conventional methods.l,2,3 One technique is to use an ultrasonic pulse to investigate the bond interface. Since the amplitude of the pulse reflected by t he bond interface is a f unction of the elastic properties of the bond, i t should be possible to correlate t he absolute ultrasonic reflectivity with t he bond strength.

Comments
Description
Keywords
Citation
DOI
Source
Copyright