Location

Thousand Oaks, CA

Start Date

1977 12:00 AM

Description

The problem of devising meaningful and reliable methods for nondestructive evaluation of adhesively bonded joints has been the subject of considerable effort for many years. It remains an important and unsolved problem. The use of conventional NOT methods involving ultrasonics is not entirely satisfactory because the thickness of a bond line is small compared with typical acoustic wavelengths and, perhaps more importantly, because the strength and service life of an adhesive bond is dependent on its chemical as well as mechanical properties. That is, an adhesive bond that is mechanically perfect may fail because of chemical degradation initiated at the adhesive/adhered interface.

Book Title

Proceedings of the ARPA/AFML Review of Progress in Quantitative NDE

Chapter

3. Adhesives and Composites

Pages

46-51

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Application of Inelastic Electron Tunneling to the Study of Adhesion

Thousand Oaks, CA

The problem of devising meaningful and reliable methods for nondestructive evaluation of adhesively bonded joints has been the subject of considerable effort for many years. It remains an important and unsolved problem. The use of conventional NOT methods involving ultrasonics is not entirely satisfactory because the thickness of a bond line is small compared with typical acoustic wavelengths and, perhaps more importantly, because the strength and service life of an adhesive bond is dependent on its chemical as well as mechanical properties. That is, an adhesive bond that is mechanically perfect may fail because of chemical degradation initiated at the adhesive/adhered interface.