Location

La Jolla, CA

Start Date

1979 12:00 AM

Description

The interfacial regions of four types of production-line microelectronic components (die-bonded transistor headers, high power silicon transistors, chip-resistors, and multilayer chip-capacitors) have been examined using a transmission scanning acoustic microscope operating at 150 MHz and a combination of modes. Flaws, voids, and defects in these components have been detected. Some characterization of these defects has also been obtained.

Book Title

Proceedings of the ARPA/AFML Review of Progress in Quantitative NDE

Chapter

7. NDE for Advanced Materials

Pages

257-262

Language

en

File Format

application/pdf

Share

COinS
 
Jan 1st, 12:00 AM

Imaging and Characterization of Thick Production-Line Microelectronic Components using Transmission Acoustic Microscopy

La Jolla, CA

The interfacial regions of four types of production-line microelectronic components (die-bonded transistor headers, high power silicon transistors, chip-resistors, and multilayer chip-capacitors) have been examined using a transmission scanning acoustic microscope operating at 150 MHz and a combination of modes. Flaws, voids, and defects in these components have been detected. Some characterization of these defects has also been obtained.