Location

Williamsburg, VA

Start Date

1-1-1986 12:00 AM

Description

The most commonly used nondestructive inspection (NDI) technique for adhesively bonded and composite structures is the ultrasonic C-scan technique operating in a pulse-echo or through-transmission mode. They are most effective in detecting disbonds, voids, delamination and foreign inslusions, but are ineffective for the detection of weak bonds at the adhesive points. Weak bonds are mostly caused by improper surface cleaning of substrates. There is no air space at the adhesive joints where the substrate and the adhesive are in intimate contact with each other. This results in a lack of interface for ultrasound reflection required for their detection by conventional ultrasonic NDI techniques. Other ultrasonic techniques such as ultrasonic spectroscopy and ultrasonic resonance testers also suffer from the same disadvantage.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

5A

Chapter

Chapter 4: Systems and Reliability

Section

Systems

Pages

853-861

DOI

10.1007/978-1-4615-7763-8_91

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Weak Bond Screening System

Williamsburg, VA

The most commonly used nondestructive inspection (NDI) technique for adhesively bonded and composite structures is the ultrasonic C-scan technique operating in a pulse-echo or through-transmission mode. They are most effective in detecting disbonds, voids, delamination and foreign inslusions, but are ineffective for the detection of weak bonds at the adhesive points. Weak bonds are mostly caused by improper surface cleaning of substrates. There is no air space at the adhesive joints where the substrate and the adhesive are in intimate contact with each other. This results in a lack of interface for ultrasound reflection required for their detection by conventional ultrasonic NDI techniques. Other ultrasonic techniques such as ultrasonic spectroscopy and ultrasonic resonance testers also suffer from the same disadvantage.