Location

La Jolla, CA

Start Date

1-1-1987 12:00 AM

Description

In this work we report the application of thermal waves to the nondestructive evaluation of multilayered samples. We have studied diffusion bonding of copper films laminated between Kapton films. We discuss the possibility of measuring the size and quality of the bonds. Delaminations elsewhere in the multilayered material have also been detected. The measurements include cases of artificial defects in the bonds and between the copper and Kapton films as well as cases of real defects. The measurement method used was the conventional infrared thermal wave imaging system. It is shown that the bonds can be analyzed and delaminations detected by thermal waves in these multilayered samples.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

6B

Chapter

Chapter 8: Materials Characterization

Section

Weldments and Bonds

Pages

1773-1777

DOI

10.1007/978-1-4613-1893-4_201

Language

en

File Format

application/pdf

Included in

Manufacturing Commons

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Jan 1st, 12:00 AM

Thermal Wave Evaluation of Kapton-Laminated Copper Diffusion Bonds

La Jolla, CA

In this work we report the application of thermal waves to the nondestructive evaluation of multilayered samples. We have studied diffusion bonding of copper films laminated between Kapton films. We discuss the possibility of measuring the size and quality of the bonds. Delaminations elsewhere in the multilayered material have also been detected. The measurements include cases of artificial defects in the bonds and between the copper and Kapton films as well as cases of real defects. The measurement method used was the conventional infrared thermal wave imaging system. It is shown that the bonds can be analyzed and delaminations detected by thermal waves in these multilayered samples.