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1988
Friday, January 1st
12:00 AM

A Noninvasive Optical Probe for Detecting Electrical Signals in Silicon IC’s

H. E. Heinrich, Stanford University
B. R. Hemenway, Stanford University
R. A. Marsland, Stanford University
D. M. Bloom, Stanford University

Williamsburg, VA

12:00 AM

Correlation of Thin-Film Bond Compliance and Bond Fracture Resistance

R. C. Addison Jr., Rockwell International Science Center
D. B. Marshall, Rockwell International Science Center

Williamsburg, VA

12:00 AM

Evaluation of Solder Bonds in a Silicon Flip Chip Device

J. T. Fanton, Stanford University
C.-H. Chou, Stanford University
B. T. Khuri-Yakub, Stanford University
G. S. Kino, Stanford University

Williamsburg, VA

12:00 AM

High Resolution Holographic Contouring

James W. Wagner, Johns Hopkins University

Williamsburg, VA

12:00 AM

Semiconductor Dimensional Metrology Using the Scanning Electron Microscope

S. G. Utterback, IBM

Williamsburg, VA

12:00 AM

Spatially Resolved Non-Contact Bulk and Surface Photovoltage Response in Semiconductors

Daniel Guidotti, IBM

Williamsburg, VA

12:00 AM

Sub-Bandgap Laser Probing of GaAs Devices and Circuits

D. M. Mechtel, Johns Hopkins University
A. G. Andreou, Johns Hopkins University
D. N. Christodoulides, Johns Hopkins University
J. Wagner, Johns Hopkins University
C. R. Westgate, Johns Hopkins University
C. H. Palmer, Johns Hopkins University
T. O. Poehler, Johns Hopkins University

Williamsburg, VA

12:00 AM

White Beam Synchrotron X-Ray Topography of Gallium Arsenide

John M. Winter Jr., Johns Hopkins University
Robert E. Green Jr., Johns Hopkins University
William S. Corak, Westinghouse

Williamsburg, VA

12:00 AM