Location

Williamsburg, VA

Start Date

1-1-1988 12:00 AM

Description

Recently we adapted two nondestructive testing techniques for the evaluation of electrical connections between a silicon device wafer and an inverted silicon interconnect chip. We used a focused acoustic microscope to check the mechanical quality of the connections, and a photothermal probe to measure their electrical conductivity. With the combination of these two techniques, we can differentiate between good bonds, partial disbonds, and complete open circuits. We can also determine the type of disbond.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

7B

Chapter

Chapter 6: Electronic Materials and Devices

Pages

1195-1202

DOI

10.1007/978-1-4613-0979-6_38

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Evaluation of Solder Bonds in a Silicon Flip Chip Device

Williamsburg, VA

Recently we adapted two nondestructive testing techniques for the evaluation of electrical connections between a silicon device wafer and an inverted silicon interconnect chip. We used a focused acoustic microscope to check the mechanical quality of the connections, and a photothermal probe to measure their electrical conductivity. With the combination of these two techniques, we can differentiate between good bonds, partial disbonds, and complete open circuits. We can also determine the type of disbond.