Location

La Jolla, CA

Start Date

1-1-1989 12:00 AM

Description

A method for full-field non-contact vibration measurement based on the Michelson Interferometer has been developed and applied to a wide range of components and structures. Unlike other optical techniques such as holography, the vibration imager does not require a specialized laboratory and stable environment, works over a much wider dynamic range,and the vibration time history is available for a more detailed analysis of the structures response. Use of this technique to detect delaminations in graphite/epoxy specimens is explored in this paper. The data was compared with X-ray and ultrasonic methods. The integrity of solder joints in electronic circuit boards has also been studied by this method at the University of Wisconsin, Madison and is also presented in this paper.

Volume

8B

Chapter

Chapter 6: Electronic Materials and Devices

Section

Electronic Materials and Devices

Pages

1273-1280

DOI

10.1007/978-1-4613-0817-1_159

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Detection of Composite Delaminations and Broken Solder Joints by a Full-Field Laser Doppler Technique

La Jolla, CA

A method for full-field non-contact vibration measurement based on the Michelson Interferometer has been developed and applied to a wide range of components and structures. Unlike other optical techniques such as holography, the vibration imager does not require a specialized laboratory and stable environment, works over a much wider dynamic range,and the vibration time history is available for a more detailed analysis of the structures response. Use of this technique to detect delaminations in graphite/epoxy specimens is explored in this paper. The data was compared with X-ray and ultrasonic methods. The integrity of solder joints in electronic circuit boards has also been studied by this method at the University of Wisconsin, Madison and is also presented in this paper.