Location

La Jolla, CA

Start Date

1-1-1989 12:00 AM

Description

The most common approach to model a weakened bond at a solid-solid interface has been to allow for a partial slip of the displacement at the interface. This concept is transformed into a specific set of boundary conditions which are then solved to obtain the plane-wave reflection and transmission coefficients or to determine the dispersion relation of the associated interface wave, if they exist. A key question in this approach is whether one allows for a partial slip in both displacement components or just the tangential. Initially, Murty [1–2] considered only the tangential slip to model the slip interface with the following boundary conditions: Normal stress is continuous; Shear stress is continuous; Normal displacement is continuous; and Shear stress is proportional to a tangential displacement slip.

Volume

8B

Chapter

Chapter 9: Characterization of Materials

Section

Solid-State Bonds and Joints

Pages

1933-1940

DOI

10.1007/978-1-4613-0817-1_245

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Solid-Solid Bonding Characterization by Ultrasonic Reflectivity

La Jolla, CA

The most common approach to model a weakened bond at a solid-solid interface has been to allow for a partial slip of the displacement at the interface. This concept is transformed into a specific set of boundary conditions which are then solved to obtain the plane-wave reflection and transmission coefficients or to determine the dispersion relation of the associated interface wave, if they exist. A key question in this approach is whether one allows for a partial slip in both displacement components or just the tangential. Initially, Murty [1–2] considered only the tangential slip to model the slip interface with the following boundary conditions: Normal stress is continuous; Shear stress is continuous; Normal displacement is continuous; and Shear stress is proportional to a tangential displacement slip.