Location

Brunswick, ME

Start Date

1-1-1990 12:00 AM

Description

The IC industry has improved process yield and device reliability considerably over the last few years. Much of the improvement is the result of continuing reduction in the defect density on IC wafers, a result made possible in part through the use of suitable defect detection and wafer inspection systems. These systems, however, are useful only for surface or visible defects.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

9B

Chapter

Chapter 6: Electronic and Ceramic Materials

Pages

1087-1092

DOI

10.1007/978-1-4684-5772-8_138

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Thermal Wave Imaging of Nonvisible Defects in IC Devices

Brunswick, ME

The IC industry has improved process yield and device reliability considerably over the last few years. Much of the improvement is the result of continuing reduction in the defect density on IC wafers, a result made possible in part through the use of suitable defect detection and wafer inspection systems. These systems, however, are useful only for surface or visible defects.