Presenter Information

Lee H. Pearson, Thiokol Corporation

Location

Brunswick, ME

Start Date

1-1-1990 12:00 AM

Description

Organic contaminants such as hydrocarbons and silicones that may be present on bonding surfaces are known to degrade bond strength when cured into the bondline. In-situ characterization of bonding surface contamination is desirable but is somewhat limited by available techniques. Optically Stimulated Electron Emission (OSEE) has been developed and used for qualitative detection of contaminants on some types of surfaces (primarily metals) and infrared (IR) spectroscopy is conventionally used for laboratory evaluation of contamination samples wiped from a bonding surface and dissolved in a solvent. This paper presents an IR external reflection spectroscopy imaging technique for in-situ bonding surface contamination detection and characterization. Methods for optimizing sensitivity to thin organic films are discussed. A discussion of the use of this technique for imaging grease contamination on composite substrate materials is given.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

9B

Chapter

Chapter 9: Manufacturing and Process Control

Pages

2017-2024

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

IR Spectroscopy for Bonding Surface Contamination Characterization

Brunswick, ME

Organic contaminants such as hydrocarbons and silicones that may be present on bonding surfaces are known to degrade bond strength when cured into the bondline. In-situ characterization of bonding surface contamination is desirable but is somewhat limited by available techniques. Optically Stimulated Electron Emission (OSEE) has been developed and used for qualitative detection of contaminants on some types of surfaces (primarily metals) and infrared (IR) spectroscopy is conventionally used for laboratory evaluation of contamination samples wiped from a bonding surface and dissolved in a solvent. This paper presents an IR external reflection spectroscopy imaging technique for in-situ bonding surface contamination detection and characterization. Methods for optimizing sensitivity to thin organic films are discussed. A discussion of the use of this technique for imaging grease contamination on composite substrate materials is given.