Location

Brunswick, ME

Start Date

1-1-1990 12:00 AM

Description

Thermal imaging for the nondestructive evaluation (NDE) of materials appears to be of ever increasing importance for industrial applications. The development of new materials. both metallic and ceramic. as thermal and oxide barrier coatings present new challenges to inspection techniques. Thermal imaging methods seem ideally suited for such applications. being particularly sensitive to surface and near surface material thermal inhomogeneities that may be defect-related. However, these same sophisticated materials can pose rather sever requirements upon the efficacy of any particular type of thermal imaging. Typical problems encountered include rough. optically scattering surfaces. surfaces ranging from highly reflective to absorptive, complex surface geometry and microscopic to very macroscopic (practical components) imaging requirements.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

9A

Chapter

Chapter 2: Advanced Techniques

Section

B: Laser-Based Methods

Pages

471-478

DOI

10.1007/978-1-4684-5772-8_58

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Laser Thermomechanical Evaluation of Bonding Integrity

Brunswick, ME

Thermal imaging for the nondestructive evaluation (NDE) of materials appears to be of ever increasing importance for industrial applications. The development of new materials. both metallic and ceramic. as thermal and oxide barrier coatings present new challenges to inspection techniques. Thermal imaging methods seem ideally suited for such applications. being particularly sensitive to surface and near surface material thermal inhomogeneities that may be defect-related. However, these same sophisticated materials can pose rather sever requirements upon the efficacy of any particular type of thermal imaging. Typical problems encountered include rough. optically scattering surfaces. surfaces ranging from highly reflective to absorptive, complex surface geometry and microscopic to very macroscopic (practical components) imaging requirements.