Location

La Jolla, CA

Start Date

1-1-1991 12:00 AM

Description

Process monitoring and control of semiconductor fabrication parameters, like film thickness, are important issues, limited at the present time by a lack of adequate sensors. In this paper, we outline the limitations of current film thickness technology and propose two new methods for nondestructive film thickness process monitoring: acoustic time domain reflectometry (TDR) and acoustic reflection coefficient phase measurements. Theoretical calculations and experimental measurements of different metal films are used to demonstrate the viability of these novel techniques.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

10B

Chapter

Chapter 9: Manufacturing and Reliability

Pages

2217-2223

DOI

10.1007/978-1-4615-3742-7_142

Language

en

File Format

application/pdf

Included in

Manufacturing Commons

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Jan 1st, 12:00 AM

Process Monitoring Techniques using Acoustic Waves

La Jolla, CA

Process monitoring and control of semiconductor fabrication parameters, like film thickness, are important issues, limited at the present time by a lack of adequate sensors. In this paper, we outline the limitations of current film thickness technology and propose two new methods for nondestructive film thickness process monitoring: acoustic time domain reflectometry (TDR) and acoustic reflection coefficient phase measurements. Theoretical calculations and experimental measurements of different metal films are used to demonstrate the viability of these novel techniques.