Location

La Jolla, CA

Start Date

1-1-1991 12:00 AM

Description

Diffusion bonding is a useful joining technique that allows similar and dissimilar materials to be bonded together in near net shape. Although modelling of the diffusion bonding process has been done to predict the bonding parameters needed to achieve parent metal mechanical properties (1,2), the possibility still exists that defects will be present in the bonded plane. There are three classes of defects that can be formed, with voids being the most common and heavily studied ones (3–8). Contamination of the bond line is a serious defect and the effect on NDE interrogation has been discussed previously by the authors (8) and others (3). A “kissing bond” is another type of defect which is difficult to detect and is the focus of this paper. It is the purpose of this work to find an NDE technique that can evaluate the bond strength uniquely, regardless of the class of defect, without any information about the bonding conditions.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

10B

Chapter

Chapter 6: Engineered Materials

Section

Joints

Pages

1383-1390

DOI

10.1007/978-1-4615-3742-7_32

Language

en

File Format

application/pdf

Included in

Manufacturing Commons

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Jan 1st, 12:00 AM

Bond Strength Evaluation in Dissimilar Materials

La Jolla, CA

Diffusion bonding is a useful joining technique that allows similar and dissimilar materials to be bonded together in near net shape. Although modelling of the diffusion bonding process has been done to predict the bonding parameters needed to achieve parent metal mechanical properties (1,2), the possibility still exists that defects will be present in the bonded plane. There are three classes of defects that can be formed, with voids being the most common and heavily studied ones (3–8). Contamination of the bond line is a serious defect and the effect on NDE interrogation has been discussed previously by the authors (8) and others (3). A “kissing bond” is another type of defect which is difficult to detect and is the focus of this paper. It is the purpose of this work to find an NDE technique that can evaluate the bond strength uniquely, regardless of the class of defect, without any information about the bonding conditions.