Location

La Jolla, CA

Start Date

1-1-1991 12:00 AM

Description

The continuai shrinking of semiconductor device geometries has heightened their sensitivity to smaller and smaller defects, and put increasing pressure on the tools used for defect detection. Further, even as the geometries are shrinking, the Silicon area needing to be inspected is growing as wafers increase in diameter from four to six, to eight, to ten, to twelve and to sixteen inches (Table 1). This paper discusses a new technology for non-destructive evaluation of defects on Silicon wafer surfaces using an Insystems 8600 Holographic defect detection System.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

10B

Chapter

Chapter 5: Electronic and Ceramic Materials

Pages

1167-1170

DOI

10.1007/978-1-4615-3742-7_4

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Holographic Inspection of Wafers for Sub-Micron Defect Detection

La Jolla, CA

The continuai shrinking of semiconductor device geometries has heightened their sensitivity to smaller and smaller defects, and put increasing pressure on the tools used for defect detection. Further, even as the geometries are shrinking, the Silicon area needing to be inspected is growing as wafers increase in diameter from four to six, to eight, to ten, to twelve and to sixteen inches (Table 1). This paper discusses a new technology for non-destructive evaluation of defects on Silicon wafer surfaces using an Insystems 8600 Holographic defect detection System.