Location

La Jolla, CA

Start Date

1-1-1991 12:00 AM

Description

This paper will review and compare the principles of operation of the scanning acoustic microscope and the focused C-scan imaging System. We will show that with phase measurement ability, both instruments are capable of inspecting electronic packages for disbonds, cracks, and other defects given. We will also show that the resolution and defect detection sensitivity of both instruments is limited by the attenuation of the sound wave in the package.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

10B

Chapter

Chapter 5: Electronic and Ceramic Materials

Pages

1179-1186

DOI

10.1007/978-1-4615-3742-7_6

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

IC Chip Package Inspection with an Amplitude and Phase Scanning Acoustic Microscope

La Jolla, CA

This paper will review and compare the principles of operation of the scanning acoustic microscope and the focused C-scan imaging System. We will show that with phase measurement ability, both instruments are capable of inspecting electronic packages for disbonds, cracks, and other defects given. We will also show that the resolution and defect detection sensitivity of both instruments is limited by the attenuation of the sound wave in the package.