Location

La Jolla, CA

Start Date

1-1-1991 12:00 AM

Description

Using a thermal wave imaging system we have been able to detect and identify a variety of microscopic defects commonly found in fine metal Al connector lines used in the IC industry. The defects of interest are hillocks, surface and subsurface Si and Cu precipitates and subsurface voids and notches. Defects as small as 0.1 μm have been detected. This thermal wave imaging system has also been used to detect subsurface defects in Al and W metal contact plugs.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

10B

Chapter

Chapter 5: Electronic and Ceramic Materials

Pages

1187-1191

DOI

10.1007/978-1-4615-3742-7_7

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

High-Resolution Thermal Wave Imaging of Surface and Subsurface Defects in IC Metal Lines

La Jolla, CA

Using a thermal wave imaging system we have been able to detect and identify a variety of microscopic defects commonly found in fine metal Al connector lines used in the IC industry. The defects of interest are hillocks, surface and subsurface Si and Cu precipitates and subsurface voids and notches. Defects as small as 0.1 μm have been detected. This thermal wave imaging system has also been used to detect subsurface defects in Al and W metal contact plugs.