Location

Brunswick, ME

Start Date

1-1-1992 12:00 AM

Description

Adhesive bonding has found extensive application in the aircraft and defense industries where the failure of a bond in any of the critical load-bearing components, for example the rotor-blade of an helicopter, can bring about a catastrophic failure. Nondestructive evaluation of adhesively bonded structures attempt to assess the key factors of bond strength and quality. The bond strength [1] is primarily determined by the thickness of the bondline, as this greatly affects the stored energy in the bond. Three factors, if determined, provide a good measure of bond quality. They are bond thickness, contact angle of adhesive to substrate, and substrate surface-free energy.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

11A

Chapter

Chapter 3: Interpretive Signal Processing and Image Reconstruction

Section

Signal Processing

Pages

975-982

DOI

10.1007/978-1-4615-3344-3_125

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Ultrasonic Signal Processing of Adhesive Bonding Data Employing Chirp-Z Transform and Adaptive Filtering Techniques

Brunswick, ME

Adhesive bonding has found extensive application in the aircraft and defense industries where the failure of a bond in any of the critical load-bearing components, for example the rotor-blade of an helicopter, can bring about a catastrophic failure. Nondestructive evaluation of adhesively bonded structures attempt to assess the key factors of bond strength and quality. The bond strength [1] is primarily determined by the thickness of the bondline, as this greatly affects the stored energy in the bond. Three factors, if determined, provide a good measure of bond quality. They are bond thickness, contact angle of adhesive to substrate, and substrate surface-free energy.