Analysis of Scanning Acoustic Microscopy Images of IC Chips
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Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.
This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.
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Abstract
The detection, isolation, and characterization of flaws in components represent a critical need in manufacturing and quality control. Nondestructive testing (NDT) provides an effective way of inspecting materials for ensuring the quality and integrity of products and systems. Consequently, nondestructive inspection finds extensive application in several industries such as steel, nuclear and electronic industries for the evaluation of complex test objects with minimal interruption of routine operations[1].