Location

Seattle, WA

Start Date

1-1-1996 12:00 AM

Description

Ceramic tape casting is critical to the electronics industry for manufacturing a wide range of components including piezoelectric actuators, MLC capacitors, and substrates for VLSI and LSI chips [1–3]. Recent regulatory changes, led by the Environmental Protection Agency concerning hazardous chemicals used in ceramic tape-casting, have renewed interest in the development of environmentally-friendly modifications to this process. In turn, this has increased interest in developing a better, fundamental understanding of how microstructural defects form and evolve during the sequence of processing steps associated with tape casting. In order to form more reliable electronic components, there is a need to develop a better, basic understanding of how to eliminate these defects by optimizing critical processing variables.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

15B

Chapter

Chapter 8: Systems, New Techniques and Process Control

Section

Process Control

Pages

2331-2338

DOI

10.1007/978-1-4613-0383-1_305

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Novel X-Ray Imaging Method for Evaluating Defect Evolution in Ceramic Tapes

Seattle, WA

Ceramic tape casting is critical to the electronics industry for manufacturing a wide range of components including piezoelectric actuators, MLC capacitors, and substrates for VLSI and LSI chips [1–3]. Recent regulatory changes, led by the Environmental Protection Agency concerning hazardous chemicals used in ceramic tape-casting, have renewed interest in the development of environmentally-friendly modifications to this process. In turn, this has increased interest in developing a better, fundamental understanding of how microstructural defects form and evolve during the sequence of processing steps associated with tape casting. In order to form more reliable electronic components, there is a need to develop a better, basic understanding of how to eliminate these defects by optimizing critical processing variables.