Location

La Jolla, CA

Start Date

1-1-1998 12:00 AM

Description

Ultrasonic spectroscopy has been widely used for characterization of thin layered structures. Most previous studies [1]–[12] have dealt mainly with analysis of the ultrasonic reflection or transmission spectra and the effect of bonding interfaces. More recently the inverse problem for interphase layer property determination from ultrasonic measurements has been addressed. Kinra and co-authors [6],[9] use normally incident ultrasonic waves for determination of the longitudinal properties of the layer. In this case the elastic modulus, thickness and density are coupled and cannot be simultaneously recovered. The method for simultaneous determination of layer thickness, density, longitudinal and shear moduli and wave attenuations has been described in [13]. A thin layer between two thick substrates(Fig. la) was considered. Experimental data at two angles (normal and one oblique) was used for reconstruction.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

17B

Chapter

Chapter 5: Engineered Materials

Section

Coatings, Films and Bond

Pages

1355-1362

DOI

10.1007/978-1-4615-5339-7_175

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Ultrasonic Characterization of Thin Plate Bonding

La Jolla, CA

Ultrasonic spectroscopy has been widely used for characterization of thin layered structures. Most previous studies [1]–[12] have dealt mainly with analysis of the ultrasonic reflection or transmission spectra and the effect of bonding interfaces. More recently the inverse problem for interphase layer property determination from ultrasonic measurements has been addressed. Kinra and co-authors [6],[9] use normally incident ultrasonic waves for determination of the longitudinal properties of the layer. In this case the elastic modulus, thickness and density are coupled and cannot be simultaneously recovered. The method for simultaneous determination of layer thickness, density, longitudinal and shear moduli and wave attenuations has been described in [13]. A thin layer between two thick substrates(Fig. la) was considered. Experimental data at two angles (normal and one oblique) was used for reconstruction.